About Ultra-miniature Balun
An ultra-miniature balun is a type of electronic component that combines a balanced-to-unbalanced (balun) transformer and a filter in a compact package. It is used to convert the balanced signal from a differential circuit to an unbalanced signal that can be used by a single-ended circuit, or vice versa.
Ultra-miniature baluns are typically used in wireless communication systems, such as mobile phones, tablets, and other portable devices, where space is at a premium. They are designed to be small and lightweight, while still maintaining high performance and efficiency.
BALF-SPI2-02D3 Description
This device is an ultra-miniature balun. The BALF-SPI2-02D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
BALF-SPI2-02D3 Pin Out Diagram
BALF-SPI2-02D3 Features
50 Ω nominal input / conjugate matched to ST S2-LP for 433 MHz frequency operation
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Small footprint
Very low profile < 620 μm after reflow
High RF performance
RF BOM and area reduction
ECOPACK®2 compliant component
BALF-SPI2-02D3 Package Information
BALF-SPI2-02D3 PCB Assembly Recommendation
BALF-SPI2-02D3 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
BALF-SPI2-02D3 Product Parameter
|
Manufacturer |
STMicroelectronics |
Manufacturer's Part # |
BALF-SPI2-02D3 |
|
Categories |
RF/IF and RFID |
Sub-Categories |
Balun |
|
Part Status |
Active |
Frequency Range |
433MHz |
|
Impedance - Unbalanced/Balanced |
50 / -Ohm |
Phase Difference |
2.1° |
|
Insertion Loss (Max) |
3.6dB |
Return Loss (Min) |
6.5dB |
|
Package / Case |
6-WFBGA, FCBGA |
Mounting Type |
Surface Mount |
|
Factory Lead Time |
11 Weeks |
Packaging |
Tape & Reel (TR) |
|
Return Loss-Min |
6.5dB |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
BALF-SPI2-02D3 Manufacturer
STMicroelectronics is a global semiconductor company that designs, develops, manufactures and markets a broad range of products, including microcontrollers, power electronics, sensors, and analog ICs. STMicroelectronics is also renowned for its efforts in sustainability, with a focus on reducing energy consumption and improving resource efficiency throughout the company's operations, as well as offering product solutions for smart mobility, green energy, and more.
